doc. no : qw0905-l rev. : date : a209b-1/2xyxg2x - 2004 15 - oct a data sheet office:7f.,no.208,sec.3,jhongyang rd.,tucheng city taipei hsien,taiwan r.o.c tel:(02)22677686(rep) fax:(02)22675286,(02)22695616 led array ligitek electronics co.,ltd. property of ligitek only la209b-1/2xyxg2x
la209b-1/2xyxg2x 1.5 max ?? 0.5 typ ?? 0.5 typ package dimensions note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. - + ly45840/f181 lg45840/f181 2.54 g 1.5 y 4.6 part no. 6.80.5 3.8typ. 2.1 3.20.3 2.54typ 1.0min + - 4.0 29.50.5 1.9 3.2 1.9 ligitek electronics co.,ltd. property of ligitek only 2.20.5 18.3 1.0 17.4 page 1/5
yellow diffused green diffused typical electrical & optical characteristics (ta=25 j ) note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. la209b-1/2xyxg2x part no yellow emitted green gap gaasp/gap lens material color soldering temperature tsol 8.0 8.0 min. luminous intensity @10ma(mcd) peak wave length f pnm 30 565 585 35 2.6 1.7 1.7 2.6 min. max. spectral halfwidth ??f nm forward voltage @ ma(v) 20 viewing angle 2 c 1/2 (deg) 78 12 12 78 typ. max 260 j for 5 sec max (2mm from body) absolute maximum ratings at ta=25 j power dissipation reverse current @5v storage temperature operating temperature peak forward current duty 1/10@10khz forward current t opr tstg ir i fp pd i f parameter part no. symbol ligitek electronics co.,ltd. property of ligitek only -40 ~ +85 10 -40 ~ +100 120 100 30 80 60 20 j j g a ma mw ma ratings g y unit page 2/5 la209b-1/2xyxg2x
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 0 80 100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip part no. 3/5 page la209b-1/2xyxg2x
1.0 relative intensity@20ma 500 0.0 0.5 wavelength (nm) 650 550 600 -40 fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature forward voltage@20ma normalize @25 j 0.8 1.0 0.9 1.1 1.2 0.5 relative intensity@20ma normalize @25 j -40 60 ambient temperature( j ) 40 20 0 -20 100 80 0.0 ambient temperature( j ) 02040 -20 60 100 80 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 1.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 forward current(ma) 0.1 10 1.0 1000 g chip relative intensity normalize @20ma 1.0 0.5 4.0 forward voltage(v) 2.0 3.0 5.0 0.0 1.5 1.0 2.0 100 forward current(ma) 10 1000 fig.2 relative intensity vs. forward current 2.5 3.0 ligitek electronics co.,ltd. property of ligitek only 3.5 part no. page 4/5 la209b-1/2xyxg2x
the purpose of this test is the resistance of the device under tropical for hous. high temperature high humidity test 1.ta=65 j? 5 j 2.rh=90%~95% 3.t=240hrs ? 2hrs mil-std-202:103b jis c 7021: b-11 thermal shock test solder resistance test solderability test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. ligitek electronics co.,ltd. property of ligitek only high temperature storage test operating life test low temperature storage test 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) reliability test: test item part no. test condition the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description reference standard 5/5 page la209b-1/2xyxg2x
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